Retaining ring with shaped profile
US8388412B2 · kind B2 · utility
11Cited by
14References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2011 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Oct 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T292/205
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.