Handler attachment for integrated circuit fabrication

US8388782B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Paul S. Andry · Yorktown Heights, US
• Bing Dang · Chappaqua, US
• John U. Knickerbocker · Wappingers Falls, US
• Aparna Prahbakar · North White Plains, US
• Peter J. Sorce · Poughkeepsie, US
• Robert E. Trzcinski · Rhinebeck, US
• Cornelia K. Tsang · Potsdam, US

Key dates

• Filing date: May 27, 2010
• Grant date: Mar 5, 2013
• Expiry date: Apr 14, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1158
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.