Electrostatic chuck assembly
US8390980B2 · kind B2 · utility
169Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2009 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Oct 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.