Method and system for routing electrical connections of semiconductor chips

US8415803B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thorsten Meyer · Regensburg, DE
• Gottfried Beer · Nittendorf, DE
• Christian Geissler · Teugn, DE
• Thomas Ort · Veitsbronn, DE
• Klaus Pressel · Regensburg, DE
• Bernd Waidhas · Nittendorf, DE
• Andreas Wolter · Regensburg, DE

Key dates

• Filing date: Aug 31, 2010
• Grant date: Apr 9, 2013
• Expiry date: Jan 3, 2031

Classification

• Technology area (CPC —): General

Abstract

A method and a system for routing electrical connections are disclosed. A semiconductor device includes a first semiconductor chip and a routing plane having a plurality of routing lines. A first connecting line is electrically coupled to the first semiconductor chip and one of the plurality of routing lines and a second connecting line is electrically coupled to the one of the plurality of routing lines and to one of a second semiconductor chip or a first external contact element.