Laser ablation for integrated circuit fabrication

US8419895B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Bing Dang · Chappaqua, US
• John U. Knickerbocker · Wappingers Falls, US
• Aparna Prabhakar · North White Plains, US
• Peter J. Sorce · Poughkeepsie, US
• Robert E. Trzcinski · Rhinebeck, US
• Cornelia K. Tsang · Potsdam, US

Key dates

• Filing date: May 27, 2010
• Grant date: Apr 16, 2013
• Expiry date: Apr 28, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1917
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.