Wafer edge inspection
US8426223B2 · kind B2 · utility
7Cited by
13References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2009 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Sep 8, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9503
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.