Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection
US8439994B2 · kind B2 · utility
3Cited by
29References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2010 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Nov 17, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.