Method for reducing tilt of transparent window during manufacturing of image sensor
US8450137B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2012 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Feb 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
Abstract
The present invention discloses a method for reducing the tilt of a transparent window during manufacturing of an image sensor. The method includes the following steps: providing a semimanufacture of the image sensor; carrying out a preheating process; carrying out an adhesive spreading process; carrying out a transparent window closing process; and carrying out a packaging process. By carrying out the preheating process, the environmental conditions can be stabilized during the adhesive spreading process and the transparent window closing process such that the transparent window can be kept highly flat after combining. By the implementation of the present invention, the chance of tilt and crack of the transparent window during manufacturing of the image sensor can be reduced, thereby achieving the goal for a better yield rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.