Protective offset sputtering
US8460519B2 · kind B2 · utility
5Cited by
29References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2006 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Mar 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3455
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Sputtering in a physical vapor deposition (PVD) chamber may, in one embodiment, utilize a target laterally offset from and tilted with respect to the substrate. In another aspect, target power may be reduced to enhance film protection. In yet another aspect, magnetron magnets may be relatively strong and well balanced to enhance film protection. In another aspect, a shutter may be provided to protect the substrate in start up conditions. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.