Method for manufacturing capped MEMS components

US8470631B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Torsten Kramer · Wannweil, DE
• Kathrin Knese · Reutlingen, DE
• Hubert Benzel · Neckartenzlingen, DE
• Karl-Heinz Kraft · Stuttgart, DE
• Simon Armbruster · Wannweil, DE

Key dates

• Filing date: Mar 19, 2010
• Grant date: Jun 25, 2013
• Expiry date: Sep 23, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/16235
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A simple and economical method for manufacturing very thin capped MEMS components. In the method, a large number of MEMS units are produced on a component wafer. A capping wafer is then mounted on the component wafer, so that each MEMS unit is provided with a capping structure. Finally, the MEMS units capped in this way are separated to form MEMS components. A diaphragm layer is formed in a surface of the capping wafer by using a surface micromechanical method to produce at least one cavern underneath the diaphragm layer, support points being formed that connect the diaphragm layer to the substrate underneath the cavern. The capping wafer structured in this way is mounted on the component wafer in flip chip technology, so that the MEMS units of the component wafer are capped by the diaphragm layer. The support points are then cut through in order to remove the substrate.