Patent · US Active

Methods of forming material over substrates

US8481122B2 · kind B2 · utility

4Cited by

11References

18Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

Chris M. Carlson · Boise, US
Vishwanath Bhat · Boise, US
F. Daniel Gealy · Kuna, US

Key dates

Filing date	Jul 12, 2006
Grant date	Jul 9, 2013
Priority date	—
Expiry date	May 7, 2030

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C16/40
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

ALD-type methods which include providing two or more different precursors within a chamber at different and substantially non-overlapping times relative to one another to form a material, and thereafter exposing the material to one or more reactants to change a composition of the material. In particular aspects, the precursors utilized to form the material are metal-containing precursors, and the reactant utilized to change the composition of the material comprises oxygen, silicon, and/or nitrogen.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.