Additives for grain fragmentation in Pb-free Sn-based solder
US8493746B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2010 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Aug 19, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.