Method for testing a test substrate under defined thermal conditions and thermally conditionable prober
US8497693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2008 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Jan 26, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.