Patent · US Active

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

US8507080B2 · kind B2 · utility

4Cited by

14References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Alfred Haimerl · Sinzing, DE
Wolfgang Schober · Amberg, DE
Michael Bauer · Nittendorf, DE
Angela Kessler · Regensburg, DE

Key dates

Filing date	Apr 26, 2006
Grant date	Aug 13, 2013
Priority date	—
Expiry date	Jun 22, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31942
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.