Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers

US8512099B2 · kind B2 · utility

Assignees

• Siltronic AG · DE
• Peter Wolters GmbH · DE

Inventors

• Michael Kerstan · Burghausen, DE
• Georg Pietsch · Burghausen, DE
• Frank Runkel · Reiskirchen, DE
• Conrad von Bechtolsheim · Rendsburg, DE
• Helge Moeller · Flensburg, DE

Key dates

• Filing date: Oct 19, 2009
• Grant date: Aug 20, 2013
• Expiry date: Feb 25, 2032

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B47/12
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove.