Process for assembling substrates with low-temperature heat treatments

US8530331B2 · kind B2 · utility

Assignee

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Remi Beneyton · Grenoble, FR
• Hubert Moriceau · Saint-Égrève, FR
• Frank Fournel · Meylan, FR
• Francois Rieutord · St-Estève, FR
• Yannick Le Tiec · Crolles, FR

Key dates

• Filing date: Oct 14, 2011
• Grant date: Sep 10, 2013
• Expiry date: Oct 14, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1059
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The invention relates to a process for producing a bond between a first and a second substrate. The process includes preparing surfaces of the substrates to be assembled, and attaching the surfaces to form an assembly of these two surfaces, by direct molecular bonding. The assembly is then heat treated, which includes maintaining the temperature within the range of 50° C. to 100° C. for at least one hour.