Patent · US Active

Method and system for minimizing carrier stress of a semiconductor device

US8531014B2 · kind B2 · utility

0Cited by

18References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Mengel · Bad Abbach, DE
Oliver Eichinger · Regensburg, DE
Khalil Hosseini · Weihmichl, DE
Joachim Mahler · Regensburg, DE

Key dates

Filing date	Sep 27, 2010
Grant date	Sep 10, 2013
Priority date	—
Expiry date	Aug 27, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and a system for minimizing carrier stress of a semiconductor device are provided. In one embodiment, a semiconductor device is provided comprising a carrier comprising a mesh coated with a metallic material, and a semiconductor chip disposed over the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.