Method for forming thin film resistor and terminal bond pad simultaneously
US8563336B2 · kind B2 · utility
15Cited by
76References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2008 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Sep 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods for forming a thin film resistor and terminal bond pad simultaneously. A method includes simultaneously forming a terminal bond pad on a terminal wire and a thin film resistor on two other wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.