Method and system for uniformly applying a multi-phase cleaning solution to a substrate
US8567421B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 15, 2011 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Dec 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.