Method of marking a low profile packaged semiconductor device
US8574961B2 · kind B2 · utility
1Cited by
15References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2003 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Jul 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device (10) is made by mounting the bottom surfaces (31, 44, 54) of a semiconductor die (14) and a lead (15, 17) on a tape (12) and over a hole (19) in the tape. A vacuum is drawn through the hole to secure the die in place when the lead's top surface (43) is wirebonded to a top surface (32) of the semiconductor die. A molding material (49) is formed to encapsulate the top surface of the semiconductor die and to expose its bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.