Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape
US8574964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2010 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Nov 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a flipchip type semiconductor die with contact pads and substrate with contact pads. A flux material is deposited over the contact pads of the semiconductor die and contact pads of the substrate. A solder tape formed as a continuous body of solder material with a plurality of recesses is disposed between the contact pads of the semiconductor die and substrate. The solder tape is brought to a liquidus state to separate a portion of the solder tape outside a footprint of the contact pads of the semiconductor die and substrate under surface tension and coalesce the solder material as an electrical interconnect substantially within the footprint of the contact pads of the semiconductor die and substrate. The contact pads on the semiconductor die and substrate can be formed with an extension or recess to increase surface area of the contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.