Single substrate processing head for particle removal using low viscosity fluid
US8584613B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2008 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Jun 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67748
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A head for dispensing a thin film over a substrate is disclosed. The head includes a body assembly that extends between a first and a second end that is at least a width of the substrate. The body includes a main bore that is defined between the first and the second ends, the main bore connected to an upper side of a reservoir through a plurality of feeds that are defined between the main bore and the reservoir. The body also includes a plurality of outlets connected to a lower side of the reservoir and extend to an output slot. The plurality of feeds have a larger cross-sectional area than the plurality of outlets and the plurality of feeds are fewer than the plurality of outlets. Wherein fluid is configured to flow through the main bore, through the plurality of feeds along the bore and fill the reservoir up to at least the threshold level before fluid is evenly output as a film out of the output slot onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.