Integrated circuit protruding pad package system and method for manufacturing thereof
US8587098B2 · kind B2 · utility
0Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Jul 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.