High temperature chuck and method of using same
US8613288B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 18, 2009 |
| Grant date | Dec 24, 2013 |
| Priority date | — |
| Expiry date | Dec 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Improved resistance to temperature-related degradation or deformation in a wafer-supporting chuck is provided by at least one shielding member that physically and/or thermally shields chuck components from effects of elevated temperature processing fluids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.