Localized surface annealing of components for substrate processing chambers
US8617672B2 · kind B2 · utility
18Cited by
325References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2005 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Jan 10, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing chamber component has a structural body with localized surface regions having annealed microcracks. The annealed microcracks reduce crack propagation and increase fracture resistance. In one method of manufacture, the structural body of the component is formed, and a laser beam is directed onto localized surface regions of the body for a sufficient time to anneal the surface microcracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.