Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed
US8617689B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2012 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Apr 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.