LED with substrate modifications for enhanced light extraction and method of making same

US8617909B2 · kind B2 · utility

Assignee

• Cree, Inc. · US

Inventors

• Max Batres · Lompoc, US
• James Ibbetson · Lompoc, US
• Ting Li · Ventura, US
• Adam William Saxler · Durham, US

Key dates

• Filing date: Apr 1, 2009
• Grant date: Dec 31, 2013
• Expiry date: Apr 1, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/01

Abstract

The surface morphology of an LED light emitting surface is changed by applying a reactive ion etch (RIE) process to the light emitting surface. Etched features, such as truncated pyramids, may be formed on the emitting surface, prior to the RIE process, by cutting into the surface using a saw blade or a masked etching technique. Sidewall cuts may also be made in the emitting surface prior to the RIE process. A light absorbing damaged layer of material associated with saw cutting is removed by the RIE process. The surface morphology created by the RIE process may be emulated using different, various combinations of non-RIE processes such as grit sanding and deposition of a roughened layer of material or particles followed by dry etching.