Integrated circuit packaging system with interlock and method of manufacture thereof
US8617933B2 · kind B2 · utility
2Cited by
10References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2011 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Apr 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead overhang at an obtuse angle to a lead top side and having a lead ridge protruding from a lead non-horizontal side, the lead overhang having a lead overhang-undercut side at an acute angle to a lead overhang non-horizontal side; forming a lead conductive cap completely covering the lead overhang non-horizontal side and the lead top side; forming a package paddle adjacent the lead; mounting an integrated circuit over the package paddle; and forming an encapsulation over the integrated circuit, the package paddle, and the lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.