Integrated circuit packaging system with an interposer and method of manufacture thereof
US8624370B2 · kind B2 · utility
5Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2009 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Jan 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: mounting a device over an integrated circuit having a through via; attaching an interposer, having an opening, and the integrated circuit with the device within the opening; and forming an encapsulation at least partially covering the integrated circuit and the interposer facing the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.