Patent · US Active

Semiconductor component comprising an interposer substrate

US8624372B2 · kind B2 · utility

5Cited by

18References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Wolfgang Hetzel · Nattheim, DE
Jochen Thomas · Munich, DE
Peter Weitz · Sauerlach, DE
Ingo Wennemuth · Munich, DE

Key dates

Filing date	Aug 22, 2006
Grant date	Jan 7, 2014
Priority date	—
Expiry date	Aug 22, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component (10) has an interposer substrate (1) as stack element of a semiconductor component stack (25). The interposer substrate (1) has, on one of the interposer substrate sides (2, 4), a semiconductor chip protected by plastics composition (12) in its side edges (22). An interposer structure (3) partly covered by a plastics composition (12) is arranged on the interposer side (2, 4) opposite to the semiconductor chip (6). Edge regions (11) of the interposer substrate (1) remain free of any plastics composition (12) and have, on both interposer sides (2, 4) external contact pads (7) which are electrically connected to one another via through contacts (8).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.