Polishing pad for eddy current end-point detection
US8628384B2 · kind B2 · utility
2Cited by
31References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2010 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Dec 2, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.