Patent · US Active

Device including a semiconductor chip and a carrier and fabrication method

US8637379B2 · kind B2 · utility

0Cited by

8References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Hannes Eder · Villach, AT
Ivan Nikitin · Regensburg, DE
Manfred Schneegans · Vaterstetten, DE
Jens Goerlich · Cologne, DE
Karsten Guth · Soest, DE
Alexander Heinrich · Bad Abbach, DE

Key dates

Filing date	Oct 8, 2009
Grant date	Jan 28, 2014
Priority date	—
Expiry date	Jul 15, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.