Integrated circuit package-on-package stacking system and method of manufacture thereof
US8643163B2 · kind B2 · utility
30Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2009 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Aug 3, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package-on-package stacking system includes: providing a first integrated circuit package, mounting a metalized interposer substrate over the first integrated circuit package, attaching a stiffener integrated with the metalized interposer substrate and having dimensions within package extents, and attaching a second integrated circuit package on the metalized interposer substrate adjacent the stiffener.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.