Target for sputtering chamber
US8647484B2 · kind B2 · utility
2Cited by
167References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2006 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Mar 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3497
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate has a groove. The sputtering plate comprises a cylindrical mesa having a plane, and an annular inclined rim surrounding the cylindrical mesa. In one version, the backing plate comprises a material having a high thermal conductivity and a low electrical resistivity. In another version, the backing plate comprises a backside surface with a single groove or a plurality of grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.