Patent · US Active

Chip package and a method for manufacturing a chip package

US8669655B2 · kind B2 · utility

19Cited by

1References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ottmar Geitner · Pentling, DE
Walter Hartner · Munich, DE
Maciej Wojnowski · Munich, DE
Ulrich Wachter · Regensburg, DE
Michael Bauer · Nittendorf, DE
Andreas Stueckjuergen · Regensburg, DE

Key dates

Filing date	Aug 2, 2012
Grant date	Mar 11, 2014
Priority date	—
Expiry date	Aug 2, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18162
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.