Laser ablation of adhesive for integrated circuit fabrication

US8679280B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Bing Dang · Chappaqua, US
• Matthew J. Farinelli · The Bronx, US
• John U. Knickerbocker · Wappingers Falls, US
• Aparna Prabhakar · North White Plains, US
• Robert E. Trzcinski · Rhinebeck, US
• Cornelia K. Tsang · Potsdam, US

Key dates

• Filing date: May 27, 2010
• Grant date: Mar 25, 2014
• Expiry date: Aug 5, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1917
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.