Chemical mechanical planarization pad with void network
US8684794B2 · kind B2 · utility
15Cited by
14References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2008 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Jul 12, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.