Patent · US Active

Chip comprising a fill structure

US8704338B2 · kind B2 · utility

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19Claims

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Assignee

Infineon Technologies AG · DE

Inventors

Gunther Mackh · Dresden, DE
Gerhard Leschik · Regensburg, DE
Adolf Koller · Regensburg, DE
Harald Seidl · Brandenburg an der Havel, DE

Key dates

Filing date	Sep 28, 2011
Grant date	Apr 22, 2014
Priority date	—
Expiry date	Oct 7, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH10D84/01
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip includes a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.