Integrated circuit packaging system with an encapsulation and method of manufacture thereof
US8709877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2012 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jun 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming an integrated circuit device having a device contact surface, a device lateral side, and a device backside opposite the device contact surface; forming a device shell, having a shell lip, contiguous with the device backside and the device lateral side, the shell lip adjacent to and coplanar with the device contact surface; attaching a substrate to the integrated circuit device, the device shell between the integrated circuit device and the substrate; and forming an encapsulation on the substrate and covering the integrated circuit device and the device shell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.