Patent · US Active

Methods for processing substrates in process systems having shared resources

US8721798B2 · kind B2 · utility

2Cited by
1References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 29, 2010
Grant dateMay 13, 2014
Priority date
Expiry dateMay 5, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/32899
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

Methods for processing substrates in twin chamber processing systems having first and second process chambers and shared processing resources are provided herein. In some embodiments, a method may include providing a substrate to the first process chamber of the twin chamber processing system, wherein the first process chamber has a first processing volume that is independent from a second processing volume of the second process chamber; providing one or more processing resources from the shared processing resources to only the first processing volume of the first process chamber; and performing a process on the substrate in the first process chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.