Electrically interconnected stacked die assemblies

US8723332B2 · kind B2 · utility

Assignee

• Invensas LLC · US

Inventors

• Simon J. S. McElrea · Scotts Valley, US
• Lawrence Douglas Andrews, JR. · Soquel, US
• Scott McGrath · Scotts Valley, US
• Terrence Caskey · Santa Cruz, US
• Scott Jay Crane · Aromas, US
• Marc E. Robinson · San Jose, US
• Loreto Cantillep · Singapore, SG

Key dates

• Filing date: May 20, 2008
• Grant date: May 13, 2014
• Expiry date: Jan 19, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.