Method and system for uniformly applying a multi-phase cleaning solution to a substrate
US8726919B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2013 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Sep 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for cleaning a substrate includes a carrier and a cleaning station. The carrier is capable of holding the substrate and is movably coupled to a pair of guide tracks extending a length of the system. The cleaning station includes a force applicator and a gate. The force applicator has an applicator length and is operatively coupled to the cleaning station. The force applicator is rotatable and is adjusted to a first height off the surface of the carrier as the substrate is being cleaned. The force applicator has a hollow structure with internal channels and openings dispersed throughout the applicator length to dispense cleaning solution to substrate surface. The gate is affixed to a trailing edge of the force applicator and is set to a second height off the surface of the carrier. The gate includes a gate length that at least spans the applicator length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.