Methods of processing substrates
US8728721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2011 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Sep 21, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0035
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of processing a substrate includes forming first photoresist on a substrate. A portion of the first photoresist is selectively exposed to actinic energy and then the first photoresist is negative tone developed to remove an unexposed portion of the first photoresist. Second photoresist is formed on the substrate over the developed first photoresist. A portion of the second photoresist is selectively exposed to actinic energy and then the second photoresist is negative tone developed to remove an unexposed portion of the second photoresist and form a pattern on the substrate which comprises the developed first photoresist and the developed second photoresist. Other implementations are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.