PECVD process chamber backing plate reinforcement
US8733279B2 · kind B2 · utility
3Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2008 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Oct 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention generally comprises a backing plate reinforcement apparatus for use in a plasma enhanced chemical vapor deposition apparatus. When processing large area substrates, the backing plate extending across the chamber may also be quite large. By supporting a central area of the backing plate with a frame structure, the backing plate may be maintained substantially planar. Alternatively, as necessary, the contour of the backing plate may be adjusted to suit the particular needs of the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.