Method for making high-K metal gate electrode structures by separate removal of placeholder materials
US8735270B2 · kind B2 · utility
2Cited by
2References
20Claims
0Family size
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Key dates
| Filing date | May 7, 2013 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | May 7, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/601
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a replacement gate approach, a superior cross-sectional shape of the gate opening may be achieved by performing a material erosion process in an intermediate state of removing the placeholder material. Consequently, the remaining portion of the placeholder material may efficiently protect the underlying sensitive materials, such as a high-k dielectric material, when performing the corner rounding process sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.