Method for compensation of variability in chemical mechanical polishing consumables
US8758085B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Sep 3, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.