Method of grooving a chemical-mechanical planarization pad
US8758659B2 · kind B2 · utility
1Cited by
28References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 29, 2010 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Apr 3, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)≦(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.