Method for supporting semiconductor wafer and wafer supporting assembly
US8776363B2 · kind B2 · utility
3Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Aug 2, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for supporting a semiconductor wafer includes providing a device wafer to a magnetizable ring, providing a magnetizable carrier to the device wafer, and magnetizing the magnetizable ring and the magnetizable carrier to form a magnetized clamp having a magnetized ring and magnetized carrier. The magnetized clamp securely clamps the device wafer therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.