Inventor · Sichuan, CN

Yan-Da Chen

17Patents
3h-index
24Co-inventors
56Inventor score

Filing activity: Mar 17, 2011 → Jan 12, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8776363B2 Method for supporting semiconductor wafer and wafer supporting assembly Emerging Cross-Sectional Technologies 3 Active
US8536709B1 Wafer with eutectic bonding carrier and method of manufacturing the same Electricity 3 Active
US8929748B2 Tunable dense wavelength division multiplexing transceiver, circuits and devices therefor, and methods for making and using such transceivers, circuits and devices Electricity 3 Active
US10523598B2 Multi-path virtual switching Electricity 1 Active
US10115582B2 Semiconductor device and method for manufacturing the same Electricity 1 Active
US9668064B2 Microelectromechanical system microphone Electricity 1 Active
US10475640B2 Method for manufacturing semiconductor device Electricity 0 Active
US11378734B1 Electronic device and indicator module thereof Physics 0 Active
US11888170B2 Clamping member and battery accommodating device Emerging Cross-Sectional Technologies 0 Active
US11442220B1 Electronic device and light indicator module thereof Physics 0 Active
US11253059B2 Cabinet Electricity 0 Active
US11976783B2 Electronic device and mounting structure thereof Mechanical Engineering; Lighting; Heating 0 Active
US11638367B2 Electronic device and heat dissipating electromagnetic shielding structure Electricity 0 Active
US11635166B2 Electronic device and mounting structure thereof Mechanical Engineering; Lighting; Heating 0 Active
US10469374B2 Multiple provider framework for virtual switch data planes and data plane migration Electricity 0 Active
US11839027B2 Electronic device with connector structure Electricity 0 Active
US8754504B2 Thinned wafer and fabricating method thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.