Chia-Wen Lien
6Patents
2h-index
12Co-inventors
40Inventor score
Filing activity: May 23, 2012 → Mar 28, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8776363B2 | Method for supporting semiconductor wafer and wafer supporting assembly | Emerging Cross-Sectional Technologies | 3 | Active |
| US8536709B1 | Wafer with eutectic bonding carrier and method of manufacturing the same | Electricity | 3 | Active |
| US11112366B2 | Reagent and kit for enhancing chemiluminescent reaction | Physics | 0 | Active |
| US10711185B2 | Reagent and kit for performing chemiluminescent reaction | Chemistry; Metallurgy | 0 | Active |
| US8754504B2 | Thinned wafer and fabricating method thereof | Electricity | 0 | Active |
| US9972554B2 | Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.